Microsoft Corporation is among the biggest names when it comes to the world of software technology. However, over the past few years, the company has been trying hard to move into the hardware market space, and is looking forward towards innovating the hardware side of business. Microsoft, with the Hololens, has something really unique with them. The company started shipping out the developers edition of the device this March. However, the most interesting part about this was, that since March, there were no updates on the exact specs and the processing power of Hololens’ processor.

Microsoft made the announcement yesterday, which finally gives the markets and insight into the Hololens. The company has announced the specs and details of the Holographic Processing Unit (HPU), which is located inside this AR headset. The announcement came during the Hot Chips conference, held in Cupertino, California.

As per Microsoft, the HPU comes out with 8MB of SRAM, 1GB of LPDDR3 RAM, around 65 million logic gates, and it all fits in 12mm-by-12mm BGA package which is capable of performing a trillion calculations per second.  This HPU can gather the data from the sensors of the Hololens, and processes the movements of the user. This is the brain of the device which acts as the co-ordinator between all the functions of the Hololens.

It is also worth noting that the device does not work on solely the HPU. Along with the HPU, the HoloLens also comes out with a 14nm 64-bit Intel Atom x86 Cherry Trail SOC. The device runs on a 32-bit version of Windows 10 OS. Microsoft is indeed taking the hardware markets one major step forward with the Hololens. The company has been innovating the market like never before, and is all set to now bring forward their latest hardware device forward. While no details on the official launch are available as of now, stay tuned with us for more details.